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XC4052XL-1BG560I

IC FPGA 352 I/O 560MBGA

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XC4052XL-1BG560I component illustration
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XC4052XL-1BG560I specifications

Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.

ManufacturerAMD
Ordering codeXC4052XL-1BG560I
FamilyOther Xilinx
Package560-LBGA Exposed Pad, Metal
Product StatusObsolete
DigiKey ProgrammableNot Verified
Number of LABs/CLBs1936
Number of Logic Elements/Cells4598
Total RAM Bits61952
Number of I/O352
Number of Gates52000
Voltage - Supply3V ~ 3.6V
Mounting TypeSurface Mount
Operating Temperature-40°C ~ 100°C (TJ)
Package / Case560-LBGA Exposed Pad, Metal
Supplier Device Package560-MBGA (42.5x42.5)

Documents and evidence

XC4052XL-1BG560I ↗

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  2. Keep package, speed grade and temperature suffixes
  3. Review configuration memory and board power
  4. Request batch photographs for acceptance
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