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XC4062XL-09BG560C

IC FPGA 384 I/O 560MBGA

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XC4062XL-09BG560C component illustration
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XC4062XL-09BG560C specifications

Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.

ManufacturerAMD
Ordering codeXC4062XL-09BG560C
FamilyOther Xilinx
Package560-LBGA Exposed Pad, Metal
Product StatusObsolete
DigiKey ProgrammableNot Verified
Number of LABs/CLBs2304
Number of Logic Elements/Cells5472
Total RAM Bits73728
Number of I/O384
Number of Gates62000
Voltage - Supply3V ~ 3.6V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case560-LBGA Exposed Pad, Metal
Supplier Device Package560-MBGA (42.5x42.5)

Documents and evidence

XC4062XL-09BG560C ↗

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  2. Keep package, speed grade and temperature suffixes
  3. Review configuration memory and board power
  4. Request batch photographs for acceptance
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