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XCV2000E-6FG860C

IC FPGA 660 I/O 860FBGA

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XCV2000E-6FG860C component illustration
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XCV2000E-6FG860C specifications

Recorded source facts. Missing values are kept explicit; verify the exact manufacturer document before design approval.

ManufacturerAMD
Ordering codeXCV2000E-6FG860C
FamilyOther Xilinx
Package860-BGA Exposed Pad
Product StatusObsolete
DigiKey ProgrammableNot Verified
Number of LABs/CLBs9600
Number of Logic Elements/Cells43200
Total RAM Bits655360
Number of I/O660
Number of Gates2541952
Voltage - Supply1.71V ~ 1.89V
Mounting TypeSurface Mount
Operating Temperature0°C ~ 85°C (TJ)
Package / Case860-BGA Exposed Pad
Supplier Device Package860-FBGA (42.5x42.5)

Documents and evidence

XCV2000E-6FG860C ↗

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